Handling of 0201 mounting to 0.3mm Fine Pitch QFP, 0.5mm BGA and 0.3mm µBGA and chip scale packages.
World’s fastest mounting speed in its class — 5% faster than the YSM20.
Featuring a new wide-scan camera with improved component adaptability.
Optional features that improve line operating rate without stopping the machine.
Built-in features from high-end machine models deliver high print accuracy and quality.
Multiple functions and extreme versatility all wrapped into 1 compact unit.
Support for Yamaha SMT production line network, delivers highly efficient production.
The YSi-V is the first in the industry to utilise both a 12Megapixels industrial grade high-resolution camera, along with a high-pixel compatible telecentric lens having the high-resolution indispensable for high-accuracy inspections.
In addition to the 12μm lens, the lineup also includes a 7μm lens that enables higher resolution inspection. Adding a high-speed image processing control system and other features achieves high-speed along with high-accuracy and expanded field of vision.
2D high-speed, high-resolution 2-dimensional inspections
3D Height, and sloped surface 3-dimensional inspections
4D∠ 4-direction angular camera
IC Baking Oven
Humidity Chamber
Hot Bar Soldering
SMTDR300 Desktop PCB Router
Semi Auto Dispenser
BGA Rework System ( WDS 650 )
Ready to stay ahead with our top-notch PCB services? Let us share with you how it’s done.